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2006

2005

Bhattacharya, Prajesh, Patrick E. Phelan, and Ravi S. Prasher."Computational Analysis of the Colloidal Stability of Nanofluids."International Mechanical Engineering Congress & Exposition (2005).
Sarangi, , R K, Anandaroop Bhattacharya, Ravi S. Prasher, and Sridhar Narasimhan."Numerical Modeling of Boiling Heat Transfer in Microchannels."ASME 2005 International Mechanical Engineering Congress and Exposition (2005) 739–748. DOI
Prasher, Ravi S.."Thermal boundary resistance of nanocomposites."Int. J. Heat Mass Transf. 48 (2005) 4942–4952. DOI
Prasher, Ravi S.."Modeling of Phonon Thermal Conductivity of Two Dimensional Nano and Micro Composites in the Longitudinal Direction."ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005) 359–363. DOI
Chang, Je-Young, Ravi S. Prasher, David Chau, Alan M. Myers, John Dirner, Suzana Prstic, and Dongming He."Convective Performance of Package Based Single Phase Microchannel Heat Exchanger."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference (2005) 183–188. DOI
Prasher, Ravi S., John Dirner, Je-Young Chang, Alan M. Myers, David Chau, Suzana Prstic, and Dongming He."Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference (2005) 99–103. DOI
Prasher, Ravi S., and Patrick E. Phelan."Modeling of Radiative and Optical Behavior of Nanofluids Based on Multiple and Dependent Scattering Theories."ASME 2005 International Mechanical Engineering Congress and Exposition (2005) 739–743. DOI
Hu, , Xuejiao, Ravi S. Prasher, and Kenneth E Goodson."Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling."ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005) 963–966. DOI