Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink

Integrated circuit (IC) packages employing two-phase microchannel heat exchangers for cooling the packages' IC dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is thermally coupled to a pair of microchannel heat exchangers disposed on opposite sides of the die. Top-side microchannel heat exchangers include a thermal mass having a plurality of open microchannels having wall bases that are hermetically sealed with the top surface of the die, thus forming a plurality of closed microchannels. Alternatively, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. Bottom-side heat exchangers include substrates and chip carriers having microchannels formed therethrough that are thermally coupled to the IC die. The cooling systems employ a plurality of microchannel heat exchangers to cool selected electronic components.