Reset Search

2006

Prasher, Ravi S."Heat flux based microchannel heat exchanger architecture for two phase and single phase flows." (2006).
Prasher, Ravi S, and Patrick E Phelan."A Unified Microscopic and Macroscopic Thermal Contact Resistance Model."ASME 2006 International Mechanical Engineering Congress and Exposition (2006) 525–533. DOI
Prasher, Ravi S."Beating the Thermal Conductivity of Air Using Packed Nanoparticle Bed."ASME 2006 International Mechanical Engineering Congress and Exposition (2006) 457–462. DOI
Kim, Sarah E, R R Scott List, James G Maveety, Alan M Myers, Quat T Vu, Ravi S Prasher, and Ravindranath V Mahajan."Electro-osmotic pumps and micro-channels." (2006).
Chrysler, Gregory M, and Ravi S Prasher."Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon." (2006).
Kim, Sarah E, R R Scott List, James G Maveety, Alan M Myers, Quat T Vu, Ravi S Prasher, Ravi Mahajan, and Gilroy Vandentop."Using external radiators with electroosmotic pumps for cooling integrated circuits." (2006).
Chang, Je-Young, Ravi S Prasher, Paul J Gwin, and Ioan Sauciuc."Apparatus and associated method for microelectronic cooling." (2006).
Prasher, Ravi S."Thermal conductivity of composites of aligned nanoscale and microscale wires and pores."J. Appl. Phys. (2006). DOI
Prasher, Ravi S."Thermal conductivity of hollow nanowires."Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. (2006) 11 pp.–1170. DOI
Prasher, Ravi S."Thermal conductivity of tubular and core/shell nanowires."Appl. Phys. Lett. 89 (2006) 063121. DOI
Prasher, Ravi S."Thermal Interface Materials: Historical Perspective."Status, and Future Directions (2006).
Prasher, Ravi S."Thermal interface materials: historical perspective, status, and future directions."Proc. IEEE (2006). DOI
Prasher, Ravi S."Thermal Radiative Transport in Dense Absorbing and Scattering Nano and Micro Particulate Media."ASME 2006 International Mechanical Engineering Congress and ExpositionHeat Transfer, Volume 1 2006 (2006). DOI
Prasher, Ravi S, Tao Tong, and Arun Majumdar."Thermal Resistance of Nano Constrictions."ASME 2006 International Mechanical Engineering Congress and Exposition (2006) 535–540. DOI
Prasher, Ravi S."Thermal Transport Due to Phonons in Random Nano-particulate Media in the Multiple and Dependent (Correlated) Elastic Scattering Regime."J. Heat Transfer 128 (2006) 627–637. DOI
Prasher, Ravi S."Ultralow thermal conductivity of a packed bed of crystalline nanoparticles: A theoretical study."Phys. Rev. B Condens. Matter 74 (2006) 165413. DOI

2005

Prasher, Ravi S, and Ravi Mahajan."Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink." (2005).
Torresola, Javier, Chia-Pin Chiu, Gregory M Chrysler, Dean Grannes, Ravi Mahajan, Ravi S Prasher, and Abhay A Watwe."Density factor approach to representing impact of die power maps on thermal management."IEEE Trans. Adv. Packag. 28.4 (2005) 659–664. DOI
Prasher, Ravi S, J Y Chang, Ioan Sauciuc, and others others."Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions."Intel Technology (2005).
Sarangi, R K, Anandaroop Bhattacharya, Ravi S Prasher, and Sridhar Narasimhan."Numerical Modeling of Boiling Heat Transfer in Microchannels."ASME 2005 International Mechanical Engineering Congress and Exposition (2005) 739–748. DOI
Prasher, Ravi S."Thermal boundary resistance of nanocomposites."Int. J. Heat Mass Transf. 48 (2005) 4942–4952. DOI
Prasher, Ravi S."Predicting the thermal resistance of nanosized constrictions."Nano Lett. 5 (2005) 2155–2159. DOI
Prasher, Ravi S, and Ravi Mahajan."Micro-channel heat exchangers and spreaders." (2005).
Montgomery, Stephen, William Berry, Ven R Holalkere, and Ravi S Prasher."Three-dimensional nanotube structure." (2005).
Prasher, Ravi S."Modeling of Phonon Thermal Conductivity of Two Dimensional Nano and Micro Composites in the Longitudinal Direction."ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005) 359–363. DOI