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2004

Prasher, Ravi S."Thermoelectrically cooling electronic devices." (2004).

2003

Prasher, Ravi S, Abhay A Watwe, Gregory M Chrysler, Kristopher J Frutschy, Leo Ofman, and Ajit Sathe V."Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment." (2003).
Cho, Eun Seok, Jae-Mo Koo, Linan Jiang, Ravi S Prasher, Min Soo Kim, J G Santiago, T W Kenny, and Kenneth E Goodson."Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots."Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. (2003) 242–246. DOI
Prasher, Ravi S."Phonon Transport in Anisotropic Scattering Particulate Media."ASME 2003 International Mechanical Engineering Congress and Exposition (2003) 275–283. DOI
Prasher, Ravi S."A simplified conduction based modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."J. Electron. Packag. (2003). DOI
Frutschy, Kristopher J, Ravi S Prasher, Eric Distefano, and Ajit Sathe V."Direct heatpipe attachment to die using center point loading." (2003).
Prasher, Ravi S, P Koning, J Shipley, and others others."Dependence of thermal conductivity and mechanical rigidity of particle-laden polymeric thermal interface material on particle volume fraction."Journal of (2003). DOI
Prasher, Ravi S."Generalized equation of phonon radiative transport."Appl. Phys. Lett. 83 (2003) 48–50. DOI
Sathe V, Ajit, Michael J Witherspoon, Ravi S Prasher, and Kristopher J Frutschy."Electronic assembly having a heat pipe that conducts heat from a semiconductor die." (2003).
Watwe, Abhay A, and Ravi S Prasher."Thermal cooling apparatus." (2003).
Prasher, Ravi S, J Shipley, S Prstic, and others others."Thermal resistance of particle laden polymeric thermal interface materials."ASME 2003 (2003). DOI

2002

Jiang, Linan, Jae-Mo Koo, Evelyn N Wang, Abdullahel Bari, Eun Seok Cho, Wendy Ong, Ravi S Prasher, James G Maveety, Min Soo Kim, Thomas W Kenny, Juan G Santiago, and Kenneth E Goodson."Cross-Linked Microchannels for VLSI Hotspot Cooling."ASME 2002 International Mechanical Engineering Congress and Exposition (2002). DOI
Prasher, Ravi S, J Shipley, S Prstic, and others others."Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 2–-Modeling."ASME 2002 (2002). DOI
Prasher, Ravi S, and Dave Payne."Loop heat pipe for mobile computers." (2002).
Prasher, Ravi S."System and method of heat extraction from an integrated circuit die." (2002).
Chrysler, Gregory M, Ravindranath V Mahajan, and Ravi S Prasher."Spreading in the heat sink base: Phase change systems or solid metals??."IEEE Transactions on (2002).
Koo, Jae-Mo, Sungjun Im, Eun Seok Cho, Ravi S Prasher, Evelyn N Wang, Linan Jiang, Abdullahel Bari, David Campion, David W Fogg, Min Soo Kim, Thomas W Kenny, Juan G Santiago, and Kenneth E Goodson."VLSI Hotspot Cooling Using Two-Phase Microchannel Convection."ASME 2002 International Mechanical Engineering Congress and Exposition (2002) 13–19. DOI

2001

Prasher, Ravi S, and Patrick E Phelan."Erratum: "A Scattering-Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance'' [ASME J. Heat Transfer, 123, No. 1, pp. 105–112]."Journal of Heat Transfer 123 (2001) 1194–1194. DOI
Prasher, Ravi S, J Shipley, and Amit Devpura."A simplified modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."ASME-PUBLICATIONS-HTD (2001). DOI
Prasher, Ravi S, O Alger, and Patrick E Phelan."A unified macroscopic and microscopic approach to contact conduction heat transfer."2001 National Heat (2001).
Prasher, Ravi S."Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials."J. Heat Transfer (2001). DOI
Prasher, Ravi S, and Patrick E Phelan."A Scattering-Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance."Journal of Heat Transfer 123.1 (2001) 105. DOI
Prasher, Ravi S, P Koning, J Shipley, and others others."Effect of Particle Volume Fraction on the Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material."ASME-PUBLICATIONS (2001).
Reyburn, B A, M Taya, P Koning, and Ravi S Prasher."Prediction of conductivity of composite thermal interface materials using resistor network model."Pacific Rim/International, Intersociety (2001).
Watwe, Abhay A, and Ravi S Prasher."Spreadsheet tool for quick-turn 3D numerical modeling of package thermal performance with non-uniform die heating."ASME-PUBLICATIONS-HTD (2001).