Publications

2004

Mahajan, Ravi, Chia-Pin Chiu, and Ravi S Prasher."Thermal interface materials: a brief review of design characteristics and materials."Electronics Cooling (2004).

Prasher, Ravi S."Thermal Management."The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) 1 (2004) xix–744. DOI

Prasher, Ravi S."Thermal transport cross section and phase function of longitudinal phonons for scattering by nanoparticles and microparticles."J. Appl. Phys. 96 (2004) 5202–5211. DOI

Prasher, Ravi S."Thermoelectrically cooling electronic devices." (2004).

2003

Prasher, Ravi S, Abhay A Watwe, Gregory M Chrysler, Kristopher J Frutschy, Leo Ofman, and Ajit Sathe V."Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment." (2003).

Cho, Eun Seok, Jae-Mo Koo, Linan Jiang, Ravi S Prasher, Min Soo Kim, J G Santiago, T W Kenny, and Kenneth E Goodson."Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots."Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. (2003) 242–246. DOI

Prasher, Ravi S."Phonon Transport in Anisotropic Scattering Particulate Media."ASME 2003 International Mechanical Engineering Congress and Exposition (2003) 275–283. DOI

Prasher, Ravi S."A simplified conduction based modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."J. Electron. Packag. (2003). DOI

Frutschy, Kristopher J, Ravi S Prasher, Eric Distefano, and Ajit Sathe V."Direct heatpipe attachment to die using center point loading." (2003).

Prasher, Ravi S, P Koning, J Shipley, and others others."Dependence of thermal conductivity and mechanical rigidity of particle-laden polymeric thermal interface material on particle volume fraction."Journal of (2003). DOI

Bhattacharya, Prajesh, S.K Saha, Ajay K Yadav, Patrick E Phelan, and Ravi S Prasher."Determining the Effective Thermal Conductivity of a Nanofluid Using Brownian Dynamics Simulation."National Heat Transfer Conference (2003).

Prasher, Ravi S."Generalized equation of phonon radiative transport."Appl. Phys. Lett. 83 (2003) 48–50. DOI

Sathe V, Ajit, Michael J Witherspoon, Ravi S Prasher, and Kristopher J Frutschy."Electronic assembly having a heat pipe that conducts heat from a semiconductor die." (2003).

Watwe, Abhay A, and Ravi S Prasher."Thermal cooling apparatus." (2003).

Prasher, Ravi S, J Shipley, S Prstic, and others others."Thermal resistance of particle laden polymeric thermal interface materials."ASME 2003 (2003). DOI

2002

Jiang, Linan, Jae-Mo Koo, Evelyn N Wang, Abdullahel Bari, Eun Seok Cho, Wendy Ong, Ravi S Prasher, James G Maveety, Min Soo Kim, Thomas W Kenny, Juan G Santiago, and Kenneth E Goodson."Cross-Linked Microchannels for VLSI Hotspot Cooling."ASME 2002 International Mechanical Engineering Congress and Exposition (2002). DOI

Prasher, Ravi S, J Shipley, S Prstic, and others others."Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 2–-Modeling."ASME 2002 (2002). DOI

Prasher, Ravi S, and Dave Payne."Loop heat pipe for mobile computers." (2002).

Prasher, Ravi S."System and method of heat extraction from an integrated circuit die." (2002).

Chrysler, Gregory M, Ravindranath V Mahajan, and Ravi S Prasher."Spreading in the heat sink base: Phase change systems or solid metals??."IEEE Transactions on (2002).

Koo, Jae-Mo, Sungjun Im, Eun Seok Cho, Ravi S Prasher, Evelyn N Wang, Linan Jiang, Abdullahel Bari, David Campion, David W Fogg, Min Soo Kim, Thomas W Kenny, Juan G Santiago, and Kenneth E Goodson."VLSI Hotspot Cooling Using Two-Phase Microchannel Convection."ASME 2002 International Mechanical Engineering Congress and Exposition (2002) 13–19. DOI

2001

Devpura, Amit, Patrick E Phelan, and Ravi S Prasher."Size Effects On The Thermal Conductivity Of Polymers Laden With Highly Conductive Filler Particles."Microscale Thermophysical Engineering 5.3 (2001) 177 - 189. DOI

Prasher, Ravi S, and Patrick E Phelan."Erratum: "A Scattering-Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance'' [ASME J. Heat Transfer, 123, No. 1, pp. 105–112]."Journal of Heat Transfer 123 (2001) 1194–1194. DOI

Prasher, Ravi S, J Shipley, and Amit Devpura."A simplified modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."ASME-PUBLICATIONS-HTD (2001). DOI

Prasher, Ravi S, O Alger, and Patrick E Phelan."A unified macroscopic and microscopic approach to contact conduction heat transfer."2001 National Heat (2001).