Review of Thermal Boundary Resistance of High-Temperature Superconductors

Solid-solid thermal boundary resistance plays an important role in the thermal stability of many electronic circuits, microdevices, and superconducting devices. The thermal boundary resistance (R b ) at any interface causes a temperature discontinuity, which can result in heat accumulation on one side of the boundary and raise the temperature much above the stable region, causing device failure. With the advent of high-critical-temperature (high-T c ) superconductors, it is possible to make superconducting devices at practically achievable temperatures. As the current trend goes toward the development of more and more high-Tc superconducting devices, the need for a better understanding of the thermal boundary resistance of high-Tc superconductors becomes mandatory. This paper compiles all the theoretical and experimental work to date onR b in high-Tc superconductors, both in thin-film and bulk forms, and provides a critical review of the cited works. This paper also describes the possible effect of the superconducting state onR b for high-T c superconductors, based on the experiments for both high-Tc and low-Tc bulk superconductors, and a possible explanation for these data based on the existing theory for low-T c superconductors.