Integrated circuit coolant microchannel with compliant cover

Publication Type

Patent

Date Published

08/2007

Authors

Abstract

An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.

Year of Publication

2007

URL

Organization

Research Areas